• Pretreatment: Non-conductive substrates are electrically conductive by degreasing (degreasing stains), coarsening (chemical etching to create a rough surface and enhance bonding), neutralization (removal of residual oxidants), activation (deposition of palladium catalytic centers), and electroless plating (formation of conductive metal layers, such as nickel or copper).

• Electroplating: Using electroless plating as the conductive substrate, the metal layer is thickened through electrochemical deposition, usually using a combination of copper (filling defects →and increasing conductivity), nickel (improving corrosion resistance and wear resistance), →chromium (giving metal luster and enhancing hardness)".

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Plastic Electroplating Process 

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